Chalmers

Advanced Topics in VLSI (ATV)
Course information (updated November 17, 2011)


NEWS:
111117: The 2011 ATV installment on Technology trends in computer engineering has successfully come to an end.
111111: Presentation schedule:
              Tuesday Nov 1, 13.15-14.00, 4128: Memristors: Concept to Application, by Kasyab

              Tuesday Nov 8, 13.15-14.00, 4128: 3-D Volatile Memory Integration: Trends and Issues, by Angelos
              Tuesday Nov 8, 14.15-15.00, 4128: Thermal Energy Harvesting and its Applications, by Madhavan

              Wednesday Nov 9, 13.15-14.00, 4128: MEMS/NEMS Based Power Gating, by Bhavishya
              Wednesday Nov 9, 14.15-15.00, 4128: Fabricating ICs at 14 nm and Below: Challenges and Possible Solutions, by Anurag

              Thursday Nov 10, 10.00-10.45, 4128: 3-D Integration, by Alen
              Thursday Nov 10, 11.00-11.45, 4128: Non-Volatile Memory Technologies, by Dmitry

              Tuesday Nov 15, 13.15-14.00, 4128: From SGFET to FinFET and MuGFET, by Tung
              Tuesday Nov 15, 14.15-15.00, 4128: On-Chip Optical Interconnects, by Erik

111009: Lecture material posted here: <Intro lecture>, <lecture 2 (111007)>, <Semiconductor technology lecture notes>
110904: The first meeting is on Friday September 9, 13.15-15.00, in 4128. Read "How to enroll:" below.
110830: The 2011 ATV site goes live.


GENERAL INFORMATION:

  • Basic data:
    This is a course for PhD students in the area of electronics and computer engineering.
    Start: September 2011
    Effort: ~5 credits

  • Goal:
    In the framework of a graduate course given with a three year periodicity, to disseminate and discuss selected research-related topics in advanced VLSI design.

    The topic at the 2011 installment of the course is Technology trends in computer engineering, referring to the technology evolution of integrated circuit (IC) fabrication and assembly. For example, IC feature sizes of 20-30 nanometers motivate new device structures, and die size limitations motivate three dimensional chip structures.

  • Reading:
    Due to the character of the course, we won't have any common, core textbook. Rather, information on and download of supplemental textbooks and papers will, in due time, be available.

  • General organization:
    • Seminars.
    • Self studies.

  • How to enroll:
    Email the main instructor your name and your personal id number (personnummer).

  • Instructor:
    Prof. Per Larsson-Edefors